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R5F21226KFP - MCU

Download the R5F21226KFP datasheet PDF. This datasheet also covers the R5F21226DFP variant, as both devices belong to the same mcu family and are provided as variant models within a single manufacturer datasheet.

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Note: The manufacturer provides a single datasheet file (R5F21226DFP-Renesas.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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R8C/22 Group, R8C/23 Group RENESAS MCU REJ03B0097-0200 Rev.2.00 Aug 20, 2008 1. Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1 Mbyte of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and suited to in-vehicle or FA networking. Furthermore, the data flash (1 KB x 2 blocks) is embedded in the R8C/23 Group. The difference between R8C/22 and R8C/23 Groups is only the existence of the data flash. Their peripheral functions are the same. 1.1 Applications Automotive, etc. Rev.2.
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