DA14535 - Ultra Low Power Bluetooth 5.3 SoC

Renesas

Key Features

Compatible with Bluetooth® v5.3, ETSI EN 300 328.
Clocks and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan).
Supports up to three Bluetooth® LE connections.
Typical cold boot to radioactive 35 ms.
Processing power.
32 MHz crystal and 32 MHz RC osc.
32 kHz crystal and 32/512 kHz RC osc.
15 kHz RCX as crystal replacement.
2× General purpose Timers with capture and PWM capabilities.
16 MHz 32-bit.

DA14535 ultra low power bluetooth 5.3 soc by Renesas - Datasheet Preview

Datasheet Details

Part number	DA14535
Manufacturer	Renesas
File Size	3.64 MB
Description	Ultra Low Power Bluetooth 5.3 SoC
Datasheet	DA14535 Datasheet

Other Datasheets by Renesas

Part Number	Description
DA14535MOD	SmartBond TINY Bluetooth LE Module
DA14530	Low Power Bluetooth 5.1 SoC
DA14531	Ultra Low Power Bluetooth 5.1 SoC
DA14531MOD	SmartBond TINY Bluetooth LE Module
DA14533	Bluetooth 5.3 SoC
DA14580	Bluetooth Low Energy 4.2 SoC
DA14581	Bluetooth Low Energy 4.2 SoC
DA14582	Bluetooth Low Energy 4.2 SoC
DA14583	Bluetooth Low Energy 4.2 SoC
DA14585	Bluetooth-5.0 SoC

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text

DA14535 Ultra-Low Power Bluetooth 5.3 SoC Datasheet The DA14535 is an ultra-low power SoC integrating a 2.4 GHz transceiver and an Arm® Cortex®-M0+ microcontroller with a RAM of 64 kB and a One-Time Programmable (OTP) memory of 12 kB. It can be used as a standalone application processor or as a data pump in hosted systems. Ultra-low power can be achieved using the integrated Low IQ Buck/Boost DCDC which is on during SLEEP in Buck mode. The radio transceiver, the baseband processor, and the qualified Bluetooth® low energy stack is fully compliant with the Bluetooth® Low Energy 5.3 standard. The DA14535 has dedicated hardware for the Link Layer implementation of Bluetooth® LE and interface controllers for enhanced connectivity capabilities.