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HVL147M
Silicon Epitaxial Trench Pin Diode for Antenna Switching
REJ03G0394-0300 Rev.3.00 Jan 20, 2006
Features
• • • • Adopting the trench structure improves low capacitance.(C = 0.31 pF max) Low forward resistance. (rf = 1.5 Ω max) Low operation current. Thin Extremely small Flat Lead Package (TEFP) is suitable for surface mount design.
Ordering Information
Type No. HVL147M Laser Mark N Package Name TEFP Package Code PUSF0002ZA-A
Pin Arrangement
Cathode mark Mark
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1
•
N
2 1. Cathode 2. Anode
Rev.3.
HVL147M Datasheet
