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LQFP44 - PC board footprint

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Full PDF Text Transcription for LQFP44 (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for LQFP44. For precise diagrams, and layout, please refer to the original PDF.

Philips Semiconductors PC board footprint Footprint information for reflow soldering of LQFP44 package SOT389-1 Hx Gx P2 P1 (0.125) Hy Gy By Ay C D2 (8×) Bx Ax Generic fo...

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ge SOT389-1 Hx Gx P2 P1 (0.125) Hy Gy By Ay C D2 (8×) Bx Ax Generic footprint pattern D1 Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 0.800 P2 Ax Ay Bx By C 1.500 D1 0.500 D2 0.600 Gx Gy Hx Hy 0.850 13.300 13.300 10.300 10.300 10.500 10.500 13.550 13.550 SOT389-1_fp_reflow © Koninklijke Philips Electronics N.V. 2004. All rights reserved. PDF 29 December 2004 1 of 1 Free Datasheet http://www.Datasheet4U.