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HUL7001 - Hologram Unit

Description

Pin No.

Features

  • Smaller package size achieved through micro-mirror integration (4.8 × 8.2 × 4.3 mm) Focus error signal detection : SSD method Tracking error signal detection : 3-beam method Low-power semiconductor laser included (0.3) O Y Reference plane Reference plane Apparent emitting point Apparent emitting point Reference plane.

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Full PDF Text Transcription

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Hologram Unit HUL7001 Hologram Unit For optical information processing 4.8±0.1 0.8×5=4.0±0.2 Index mark for No.1 pin on reverse side 11.2±0.2 8.2±0.2 ø8.0 +0 –0.05 1 2 3 4 5 6 (0.2) (0.5) 2.55±0.2 0.25 Lead frame 3.0±0.2 Unit : mm Features Smaller package size achieved through micro-mirror integration (4.8 × 8.2 × 4.3 mm) Focus error signal detection : SSD method Tracking error signal detection : 3-beam method Low-power semiconductor laser included (0.3) O Y Reference plane Reference plane Apparent emitting point Apparent emitting point Reference plane Applications CD SEC. X-O-Y (Note): 1.Standard corner R=0.20 max. 2.Thickness of plate:Ni 1µm min.+Au 0.1µm min. 3.Thickness of hologram=2.0mm, n=1.
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