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BZX584C30 - SURFACE MOUNT SILICON ZENER DIODES

Download the BZX584C30 datasheet PDF. This datasheet also covers the BZX584C2V4 variant, as both devices belong to the same surface mount silicon zener diodes family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • Planar Die construction.
  • 200mW Power Dissipation.
  • Zener Voltages from 2.4~75V.
  • Ideally Suited for Automated Assembly Processes.
  • Pb free product : 99% Sn above can meet RoHS environment substance diective request.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (BZX584C2V4-PanJitInternational.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription for BZX584C30 (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for BZX584C30. For precise diagrams, and layout, please refer to the original PDF.

BZX584C2V4~BZX584C75 SURFACE MOUNT SILICON ZENER DIODES VOLTAGE 2.4 to 75 Volts POWER 200 mWatts FEATURES • Planar Die construction • 200mW Power Dissipation • Zener Volt...

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TURES • Planar Die construction • 200mW Power Dissipation • Zener Voltages from 2.4~75V • Ideally Suited for Automated Assembly Processes • Pb free product : 99% Sn above can meet RoHS environment substance diective request MECHANICAL DATA • Case: SOD-523, Plastic • Terminals: Solderable per MIL-STD-750, Method 2026 • Standard packaging : 8mm tape • Weight : approximately 0.002 MAXIMUM RATINGS Parameter Power D i ssi pati on @ TA= 25OC (Note A) Operati ng Juncti on and StorageTemperature Range Symbol PD TJ Value 200 -55 to +150 U nits mW O C NOTES: A. Mounted on 5.0mm 2(.013mm thick) land areas. STAD-DEC.20.2005 PAGE .