1SMB5932
FEATURES l For surface mounted applications in order to optimize board space l Low profile package l Built-in strain relief l l l l l Glass passivated junction Low inductance Typical IR less than 1 £g A above 11V High temperature soldering : 260 ¢J /10 seconds at terminals Plastic package has Underwriters Laboratory Flammability Classification 94V-O MECHANICAL DATA Case: JEDEC DO-214AA Molded plastic over passivated junction Terminals: Solder plated, solderable per MIL-STD-750, method 2026 Polarity: Color band denotes positive end (cathode) Standard Packaging: 12mm tape (EIA-481) Weight: 0.003 ounce, 0.093 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25 ¢J ambient temperature unless otherwise specified. SYMBOL DC Power Dissipation @ TL=75 ¢J , Measure at Zero Lead Length(Note 1, Fig. 1) PD Derate above 75 ¢J Peak forward Surge Current 8.3ms single half sine-wave superimposed on rated IFSM load(JEDEC Method) (Note 1,2) Operating Junction and Storage Temperature Range...
