FFM105-M
FEATURES
- Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
- Low profile surface mounted application in order to optimize board space.
- Tiny plastic SMD package.
- High current capability.
- Fast switching for high efficiency.
- High surge current capability.
- Glass passivated chip junction.
- Lead-free parts meet Ro HS requirments.
0.031(0.8) Typ .
0.039(1.0) 0.024(0.6)
0.031(0.8) Typ .
Dimensions in inches and (millimeters)
MECHANICAL DATA
- Epoxy : UL94-V0 rated flame retardant
- Case : Molded plastic, SOD-123 / MINI SMA
- Terminals :Plated terminals, solderable per MIL-STD-750,
Method 2026
- Polarity : Indicated by cathode band
- Mounting Position : Any
- Weight : Approximated 0.027 gram
MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS
PARAMETER Forward rectified current Forward surge current
Reverse current Thermal resistance Diode junction capacitance Storage temperature
See Fig.2
CONDITIONS
8.3ms single...
