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LYQ976 - Hyper CHIPLED

Product Overview

OSRAM GmbH

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LYQ976 Hyper CHIPLED by OSRAM GmbH - Datasheet Preview — Datasheet preview – LYQ976

Datasheet Details

Part number	LYQ976
Manufacturer	OSRAM GmbH
File Size	127.07 KB
Description	Hyper CHIPLED
Datasheet	LYQ976 Datasheet
Additional preview pages of the LYQ976 datasheet.

Product details

Features

package: 0603.
feature of the device: smallest package 1.6 mm x 0.8 mm x 0.8 mm.
wavelength: 632 nm (super-red), 605 nm (orange), 587 nm (yellow).
viewing angle: extremely wide (160°).
technology: InGaAlP.
optical efficiency: 7 lm/W (super-red), 11 lm/W (orange, yellow).
assembly methods: suitable for all SMT assembly methods.
soldering methods: IR reflow soldering.
preconditioning: acc. to JEDEC Level 2.

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Published: Jan 27, 2007 |