OPB804
Features x x x x x Non- contact switching Housing opaque material Printed circuit board mount 0.155” (3.94 mm) Width Gap 0.330” (8.38 mm) Depth Slot Absolute Maximum Ratings:
(TA = 25 C unless otherwise noted)
Description
The OPB804 contains an IRLED and phototransistor paired in a plastic housing . The housing is an opaque grade of injection molded plastic which minimizes the assembly’s sensitivity to visible and near-infrared radiation. The wide open aperture makes it versatile for general applications. The output switches when a opaque object to IR (700nm to 1100nm) is inserted into the gap, between the emitter and sensor, and interrupts the light beam. Applications x x x x x Non-contact object sensing Assembly line automation Machine automation Equipment Security Machine safety
Storage Temperature Range Operating Temperature Range Lead Soldering Temperature
(1)
-40° C to +100° C -40° C to +85° C 240° C for 5 Seconds
Input IRLED
Forward DC Current Peak Forward Current (1µs...
