223 Package Ensures Level Mounting, Resulting in
Improved Thermal Conduction, and Allows Visual Inspection of Soldered Joints. The Formed Leads Absorb Thermal Stress During Soldering, Eliminating the Possibility of Damage to the Die.
Full PDF Text Transcription for PZT751 (Reference)
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PZT751 PNP Silicon Planar Epitaxial Transistor This PNP Silicon Epitaxial transistor is designed for use in industrial and consumer applications. The device is housed in ...
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use in industrial and consumer applications. The device is housed in the SOT−223 package which is designed for medium power surface mount applications. Features • High Current • The SOT−223 Package can be soldered using wave or reflow. • SOT−223 Package Ensures Level Mounting, Resulting in Improved Thermal Conduction, and Allows Visual Inspection of Soldered Joints.
PZT751 Datasheet
