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BYG26J - SMA ultra fast soft-recovery controlled avalanche rectifiers

Description

DO-214AC surface mountable package with glass passivated chip.

The well-defined void-free case is of a transfer-moulded thermo-setting plastic.

The small rectangular package has two J bent leads.

Features

  • Glass passivated.
  • High maximum operating temperature.
  • Ideal for surface mount automotive.

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Datasheet Details

Part number BYG26J
Manufacturer NXP Semiconductors
File Size 60.31 KB
Description SMA ultra fast soft-recovery controlled avalanche rectifiers
Datasheet download datasheet BYG26J Datasheet

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Full PDF Text Transcription

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DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D168 BYG26 series SMA ultra fast soft-recovery controlled avalanche rectifiers Product specification 2000 Feb 14 Philips Semiconductors Product specification SMA ultra fast soft-recovery controlled avalanche rectifiers FEATURES • Glass passivated • High maximum operating temperature • Ideal for surface mount automotive applications • Low leakage current • Excellent stability • Guaranteed avalanche energy absorption capability • UL 94V-O classified plastic package • Shipped in 12 mm embossed tape • Marking: cathode, date code, type code • Easy pick and place. Top view olumns BYG26 series DESCRIPTION DO-214AC surface mountable package with glass passivated chip.
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