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SE97B - DDR memory module temp sensor

General Description

Meets JEDEC Specification 42.4 TSE2002B1, 3 Jun 2009.

40 °C to +125 °C with JEDEC Grade B ±1 °C maximum accuracy between +75 °C and +95 °C critical zone and also provide 256 bytes of EEPROM memory communicating via the I2C-bus/SMBus.

Key Features

  • SE97 old JEDEC specification no SMBus Timeout SMBus Timeout 25 ms to 35 ms 400 kHz VIL(max) = 0.3 × VDD; VIH(min) = 0.7 × VDD set to 0 frozen set to 0 yes set to 0 50 ns 1010 0010 0000 0001 Grade B 0.6 V 3.0 V to 3.6 V 3.0 V to 3.6 V 1.7 V to 3.6 V assembly plant Hong Kong 3.0 V to 3.6 V assembly plant Bangkok (thicker die and leadframe) 0000 0011 Improved Grade B 1.8 V 0.05 × VDD set to 1 set to 1 de-assert set to 1 SE97B new JEDEC specification SMBus Timeout 25 ms to 35 ms JEDEC specification.

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Datasheet Details

Part number SE97B
Manufacturer NXP Semiconductors
File Size 453.81 KB
Description DDR memory module temp sensor
Datasheet download datasheet SE97B Datasheet

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The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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SE97B Rev. 01 — 27 January 2010 www.DataSheet4U.com DDR memory module temp sensor with integrated SPD Product data sheet 1. General description Meets JEDEC Specification 42.4 TSE2002B1, 3 Jun 2009. The NXP Semiconductors SE97B measures temperature from −40 °C to +125 °C with JEDEC Grade B ±1 °C maximum accuracy between +75 °C and +95 °C critical zone and also provide 256 bytes of EEPROM memory communicating via the I2C-bus/SMBus. It is typically mounted on a DDR3 Dual In-Line Memory Module (DIMM) measuring the DRAM temperature in accordance with the new JEDEC (JC-42.4) Mobile Platform Memory Module Temperature Sensor Component specification and also replacing the Serial Presence Detect (SPD) which is used to store memory module and vendor information.