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NTE424 - Non-Silicone Heat Sink Compound

Description

NTE424 heat sink compound is a grease like, non silicone, non migrating material heavily impregnated with heat

conductive metal oxides.

This formulation provides high thermal conductivity, low bleed and high temperature stability.

Features

  • D Non.
  • Silicone Avantages/No Creep or Migration over Wide Temperature Range D Low Interface Thermal Resistance (0.03°C.
  • In2/W) D High Thermal Conductivity, High Dielectric Strength D Exceptionally Low Bleed and Evaporation D Meets MIL.
  • C.
  • 47113 & MIS.
  • 19846 Specifications D Will Not harden, Dry.
  • Out or Melt D Will Not Contaminate Solder bath or Other Devices D Non.
  • Toxic D Reworkable/Easy to Remove D Easy to Dispense Typical Properties: Viscosity.

📥 Download Datasheet

Datasheet Details

Part number NTE424
Manufacturer NTE Electronics (defunct)
File Size 154.20 KB
Description Non-Silicone Heat Sink Compound
Datasheet download datasheet NTE424 Datasheet

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Full PDF Text Transcription

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NTE424 Non−Silicone Thermal Compound 1 oz. Plunger Tube Description: NTE424 heat sink compound is a grease−like, non−silicone, non−migrating material heavily impregnated with heat−conductive metal oxides. This formulation provides high thermal conductivity, low bleed and high temperature stability. NTE424 has been engineered to solve the problems of contamination and migration associated with silicone−based products. A unique poly synthetic−based thermal grease use to insure quick, efficient heat transfer and dissipation for the full operational life of your hardware. Key Features and Benefits: D Non−Silicone Avantages/No Creep or Migration over Wide Temperature Range D Low Interface Thermal Resistance (0.
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