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EB346 Datasheet Semiconductor Products Sector Engineering Bulletin

Manufacturer: Motorola Semiconductor (now NXP Semiconductors)

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General Description

of the pinout change for the 144-pin TQFP package.

Tolerant up to 3.6 V 144-pin TQFP or 196-pin PBGA Uses the following rules: For MF ≤ 4: CPCAP = [(680 × MF) – 120] pF For MF > 4: CPCAP = (1100 × MF) pF See Table 3 for details.

Freescale Semiconductor, Inc...

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Freescale Semiconductor, Inc.

MOTOROLA Semiconductor Products Sector Engineering Bulletin Order Number EB346/D: Rev.

2 4/20/2001 Functional Differences Between DSP56302 and DSP56309 (formerly DSP56302A) Contents 1 2 3 4 5 6 Purpose of this Document ..........

Key Features

  • 3 Input Power Changes One method to increase the operating frequency of an integrated circuit is to “shrink” the die (that is, reduce the die dimensions, both linearly and vertically). Reducing the die size can yield additional benefits, such as a reduction of power consumption, but can also result in other functional changes. The DSP56309 is a “shrink” of the DSP56302. This die size reduction enables the DSP56309 to achieve higher operating frequencies. Decreasing the die size, however, requ.

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