ABS8
FEATURES
＊Glass Passivated chip junction ＊High forward surge current capability ＊Ideal for printed circuit board ＊High temperature soldering guaranteed:
260oc/10 second at 5 lbs. (2.3kg) tension
.028(0.7) .012(0.3)
.006(0.15) .002(0.05) .177(4.5) .252(6.4) .169(4.3) .236(6.0)
.010(0.25) .006(0.15)
MECHANICAL DATA ＊Case: Transfer molded plastic ＊Epoxy: UL94V-O rate flame retardant ＊Terminals：Lead Solderable Per MIL-STD-202 method 208 ＊Polarity：As Marking on Body ＊Mounting Position: Any ＊Weight： 0.04 ounce, 1.0 gram
＊In pliance with EU Ro Hs 2002/95/EC directives
AC AC
.161(4.1) .154(3.9)
.20(5.1) .193(4.9)
.056(1.42) .059(1.50)
.048(1.22)
AC AC
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
- Rating at 25℃ ambient temperature unless otherwise specified
- Single phase,half wave. 60Hz, resistive or inductive load.
- For capacitive load derate current bh 20 %
Characteristic
Symbol ABS2
ABS4
Peak Repetitive Reverse Voltage...
