SM1003
DESCRIPTION
This line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The PIN diode chips are coated with a special hard glass passivation which is required for high power applications and to enhance the reliability resulting in MTBFs of greater than one million hours.
Ro HS pliant versions of these products meet Ro HS requirements per EU Directive 2002/95/EC. The standard terminal finish is gold unless otherwise specified. Consult the factory if you have special requirements.
SM0502
- SM1003
CONTROL DEVICES Surface Mount
- MELF PIN Diodes
Ro HS pliant Versions
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KEY FEATURES
- Non-Magnetic1 Versions Ideal for MRI Applications
- Very Low Inductance, Full Face Bonding
- Hi-Rel Hermetic Design
- Surface Mount Devices Available in Tape and Reel
- Ro HS pliant2 Versions
Availabl...
