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SMTBJ SiBOD™ series
FEATURES
G Bi-directional transient voltage protection
G Glass passivated junction
G Nano second clamping response
2.26
G Surge capability up to 250 (Amps)
G No performance degradation under service life
G Industry standard DO-2144AA Jedec outline
G Available on tape (12mm)
G UL recognised
MECHANICAL CHARACTERISTICS
G Transfer molded, void free epoxy body G Terminals: modified ‘J’ bend for large contact area G Tin/Lead plated leads G Maximum case temperature for soldering purposes: 230°C for 10 seconds G Standard packaging: 12mm tape (meets EIA 481-1) G Device marking, device code, logo
2.16
2.74
2.16
Solder Pads All dimensions in mm
2.0
B A
3.30/3.94
5.21/5.59 4.06/4.57
SEATING PLANE
.102 .203
0.76/1.27
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2.18/2.
SMTBJ050 Datasheet
