S50VB100
FEATURES
合并塑封的散热片，热阻抗低，散热量大 Integrally molded heatsink provide very low thermal resistance for maximum heat dissipation
浪涌过载额定值达 500 安培 Surge overload ratings to 500 Amperes
玻钝芯片结 Glass passivated chip junctions
高温焊接保证：260℃+5℃/10 秒，拉力 2.3Kg.F High temperature soldering guaranteed: 260℃+5℃/10 seconds，(2.3kg.F)tension
机械数据 MECHANICAL DATA
外壳：塑料与散热片一起封在桥壳内 Case: Molded plastic with heatsink integrally mounted in the bridge encapsulation
端子：镀镍 0.25＂（6.35mm）接线端子 Terminals:Nickelplaed 0.25＂（6.35mm）Faston lugs
安装：用 M5 螺丝固定在散热片上，桥和安装表面之间填充硅热混合物以达到最佳 的散热效果 Mounting Position:Fixing...
