XP2-30
Features
- flexi FLASH™ Architecture
- Instant-on
- Infinitely reconfigurable
- Single chip
- Flash BAK™ technology
- Serial TAG memory
- Design security
- Live Update Technology
- Trans FR™ technology
- Secure updates with 128 bit AES encryption
- Dual-boot with external SPI
- sys DSP™ Block
- Three to eight blocks for high performance Multiply and Accumulate
- 12 to 32 18x18 multipliers
- Each block supports one 36x36 multiplier or four
18x18 or eight 9x9 multipliers
- Embedded and Distributed Memory
- Up to 885 Kbits sys MEM™ EBR
- Up to 83 Kbits Distributed RAM
- sys CLOCK™ PLLs
- Up to four analog PLLs per device
- Clock multiply, divide and phase shifting
Data Sheet DS1009
- Flexible I/O Buffer
- sys IO™ buffer supports:
- LVCMOS 33/25/18/15/12; LVTTL
- SSTL 33/25/18 class I, II
- HSTL15 class I; HSTL18 class I, II
- PCI
- LVDS, Bus-LVDS, MLVDS, LVPECL, RSDS
- Pre-engineered Source Synchronous Interfaces
- DDR / DDR2 interfaces up to 200 MHz
- 7:1 LVDS interfaces support display...
