MCL4448
FEATURES
- Silicon epitaxial planar diode
- Fast switching diodes
- 500mw power dissipation
- High temperature soldering guaranteed
250℃/10S at terminals
MECHANICAL DATA
Case: MICRO MELF, Glass Terminals: Solderable per MIL-STD-750, Method 2026 Polarity : Color band denotes cathode end Mounting Position: Any Weight :0.011 grams
MICRO-MELF
.040(1.0) .048(1.2)DIA.
.043(1.1)
.008(0.2)
.079(2.0) .071(1.8)
.008(0.2)
Dimensions in inches and (millimeters)
Maximum Ratings ( TA=25 C Unless otherwise noted)
PARAMETER
Peak Reverse Voltage
Maximum Average Forward Current at Ta=25 OC And f >50Hz
Surge Forward Current at t < 1s and Tj= =25 OC
Power Dissipation at Tamb= 25 OC
Maximum Forward Voltage at IF =10m A Maximum Leakage Current at VR=20V at VR=75V at VR=20V ,TJ= 150OC Maximum Capacitance at VF =VR=0 Maximum Reverse Recovery Time From IF =-IR =10m A to IRR=-1m A ,VR=6V RL=100 Ω Typical Thermal Resistance
Junction Temperature and Storage Temperature Range
SYMBOL VRM IF (AV ) IF S M PTO...
