MM3Z3V0
FEATURES
Total power dissipation:max.300 m W Small plastic package suitable for surface mounted design Tolerance approximately ±5%
High temperature soldering guaranteed:260℃/10 seconds at terminals ponent in accordance to Ro HS 2002/95/EC and WEEE 2002/96/EC
MECHANICAL DATA
Case: SOD-323 plastic case Weight: Approx. 0.004 gram
SOD-323
(0.35
+0.05 -0.05
)
0.014"+-00..000022""
(1.70±0.10(
0.067"+-0.004
0.006"(0.150) MAX
(2.55±0.25) 0.100"±0.010" 5°
(1.25+-00..1100 ) 0.049"+-00..000044""
(0.95±0.15) 0.037"±0.006"
Dimensions in inches and (millimeters)
ABSOLUTE MAXIMUM RATINGS(LIMITING VALUES) (TA=25 C)
Zener current see table "Characteristics" Power dissipation Junction temperature Storage temperature range
Symbols
Ptot TJ TSTG
Value
300 150 -55 to+150
Units m W
ELECTRICAL CHARACTERISTICS (TA=25 C)
Thermal resistance junction to ambient Forward voltage at IF=10m A
Symbols RθJA VF
Min
Typ Max Units
300 K/W 0.9 V
JINAN JINGHENG ELECTRONICS CO., LTD.
10-51
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