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IRKU71 - THYRISTOR

Download the IRKU71 datasheet PDF. This datasheet also covers the IRKUV71 variant, as both devices belong to the same thyristor family and are provided as variant models within a single manufacturer datasheet.

General Description

The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.

Key Features

  • High Voltage Industrial Standard Package Thick Al metal die and double stick bonding Thick copper baseplate UL E78996 approved 3500VRMS isolating voltage ADD-A-pakTM GEN V Power Modules Benefits Up to 1600V Full compatible TO-240AA High Surge capability Easy Mounting on heatsink Al203 DBC insulator Heatsink grounded 75 A 95 A Mechanical.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (IRKUV71_InternationalRectifier.pdf) that lists specifications for multiple related part numbers.

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Other Datasheets by International Rectifier (now Infineon)

Part Number Description
IRKU105 ADD-A-pak GEN V Power Modules THYRISTOR
IRKU41 ADD-A-pakTM GEN V Power Modules
IRKU56 THYRISTOR Power Modules
IRKU91 THYRISTOR
IRK.105 THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Bulletin I27135 rev. F 10/02 IRKU/V71, 91 SERIES THYRISTOR/ THYRISTOR Features High Voltage Industrial Standard Package Thick Al metal die and double stick bonding Thick copper baseplate UL E78996 approved 3500VRMS isolating voltage ADD-A-pakTM GEN V Power Modules Benefits Up to 1600V Full compatible TO-240AA High Surge capability Easy Mounting on heatsink Al203 DBC insulator Heatsink grounded 75 A 95 A Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.