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IRKJ71 - (IRKJ56 / IRKJ71) ADD-A-pak GEN V Power Modules

Download the IRKJ71 datasheet PDF. This datasheet also covers the IRKJ56 variant, as both devices belong to the same (irkj56 / irkj71) add-a-pak gen v power modules family and are provided as variant models within a single manufacturer datasheet.

General Description

The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.

Key Features

  • High Voltage Industrial Standard Package Thick Al metal die and double stick bonding Thick copper baseplate UL E78996 approved 3500VRMS isolating voltage ADD-A-pakTM GEN V Power Modules Benefits Up to 1600V Full compatible TO-240AA High Surge capability Easy Mounting on heatsink Al203 DBC insulator Heatsink grounded 60 A 80 A Mechanical.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (IRKJ56_InternationalRectifier.pdf) that lists specifications for multiple related part numbers.

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Other Datasheets by International Rectifier (now Infineon)

Part Number Description
IRKJ71 (IRKxxx) ADD-A-pak GEN V Power Modules
IRKJ166 1600V Common Anode
IRKJ166 (IRKJxx6) STANDARD RECOVERY DIODES
IRKJ196 1600V Common Anode
IRKJ196 (IRKJxx6) STANDARD RECOVERY DIODES

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Bulletin I27140 rev. E 10/02 IRK.56, .71 SERIES STANDARD DIODES Features High Voltage Industrial Standard Package Thick Al metal die and double stick bonding Thick copper baseplate UL E78996 approved 3500VRMS isolating voltage ADD-A-pakTM GEN V Power Modules Benefits Up to 1600V Full compatible TO-240AA High Surge capability Easy Mounting on heatsink Al203 DBC insulator Heatsink grounded 60 A 80 A Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.