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IS43R16320E - 512Mb DDR SDRAM

This page provides the datasheet information for the IS43R16320E, a member of the IS43R86400E 512Mb DDR SDRAM family.

Datasheet Summary

Description

x8 A0-A12 Row Address Input A0-A9, A11 Column Address Input BA0, BA1 Bank Select Address DQ0 DQ7 Data I/O CK, CK System Clock Input CKE Clock Enable CS Chip Select CAS Column Address Strobe Command RAS Row Address Strobe Command WE Write Enable 4 66 VSS 65 DQ7 64 VSSQ

Features

  • VDD and VDDQ: 2.5V ± 0.2V (-5, -6).
  • VDD and VDDQ: 2.5V ± 0.1V (-4).
  • SSTL_2 compatible I/O.
  • Double-data rate architecture; two data transfers per clock cycle.
  • Bidirectional, data strobe (DQS) is transmitted/ received with data, to be used in capturing data at the receiver.
  • DQS is edge-aligned with data for READs and centre-aligned with data for WRITEs.
  • Differential clock inputs (CK and CK).
  • DLL aligns DQ and DQS tran.

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Datasheet preview – IS43R16320E

Datasheet Details

Part number IS43R16320E
Manufacturer Integrated Silicon Solution
File Size 699.72 KB
Description 512Mb DDR SDRAM
Datasheet download datasheet IS43R16320E Datasheet
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Full PDF Text Transcription

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IS43R86400E IS43/46R16320E, IS43/46R32160E 16Mx32, 32Mx16, 64Mx8 ADVANCED INFORMATION 512Mb DDR SDRAM NOVEMBER 2013 FEATURES • VDD and VDDQ: 2.5V ± 0.2V (-5, -6) • VDD and VDDQ: 2.5V ± 0.1V (-4) • SSTL_2 compatible I/O • Double-data rate architecture; two data transfers per clock cycle • Bidirectional, data strobe (DQS) is transmitted/ received with data, to be used in capturing data at the receiver • DQS is edge-aligned with data for READs and centre-aligned with data for WRITEs • Differential clock inputs (CK and CK) • DLL aligns DQ and DQS transitions with CK transitions • Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS • Four internal banks for concurrent operation • Data Mask for write data.
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