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SIDC78D170H
Fast switching diode chip in EMCON 3 -Technology
FEATURES:
• 1700V EMCON 3 technology 200 µm chip This chip is used for:
• soft, fast switching
• EUPEC power modules
A
• low reverse recovery charge
• small temperature coefficient
Applications:
• resonant applications, drives
C
Chip Type SIDC78D170H
VR
IF
Die Size
Package Ordering Code
1700V 150A
7.35 x 10.65 mm2
sawn on foil
Q67050-A4177A001
MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Anode metallization
Cathode metallization
Die bond Wire bond Reject Ink Dot Size
Recommended Storage Environment
7.35 x 10.65 78.28 / 61.82
mm2
5.33 x 8.
SIDC78D170H Datasheet
