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Preliminary
SIDC08D120F6
Fast switching diode chip in EMCON-Technology
FEATURES: • 1200V EMCON technology 120 µm chip • soft, fast switching
This chip is used for:
• EUPEC power modules and discrete devices
A
• low reverse recovery charge
• small temperature coefficient
Applications:
C
• SMPS, resonant applications,
drives
Chip Type SIDC08D120F6
VR
IF
1200V 7A
Die Size 2.2 x 3.7 mm2
Package Ordering Code
sawn on foil
Q67050-A4169A001
MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Anode metallisation
Cathode metallisation
Die bond Wire bond Reject Ink Dot Size
Recommended Storage Environment
2.2 x 3.7 8.14 / 4.73
mm2
2.98 x 1.
SIDC08D120F6 Datasheet
