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SIDC07D60AF6
Fast switching diode
A
Features:
This chip is used for:
• 600V Emitter Controlled technology 70 µm • power modules and discrete
chip
devices
• soft , fast switching
C
• low reverse recovery charge
• small temperature coefficient
Applications:
• SMPS, resonant applications,
drives
Chip Type
SIDC07D60AF6
VR
IF
600V 22.5A
Die Size 2.65 x 2.65 mm2
Package sawn on foil
Mechanical Parameters Raster size Area total Anode pad size Thickness Wafer size Max. possible chips per wafer Passivation frontside Pad metal
Backside metal
Die bond Wire bond Reject ink dot size
Recommended storage environment
2.65 x 2.65 7.02
mm2
2.168 x 2.
SIDC07D60AF6 Datasheet
