HYE18L256160BF-75 - DRAMs for Mobile Applications

Features

M O B I L E - R A M D E V I C E S come in a Fine-pitch Ball Grid Array (FBGA) package. These packages leverage Infineon’s proprietary wire bonding Board-On-Chip (BOC) technology for smallest form factors. The latest product generation further improves form factor by reducing package heights from 1.2 to 1 mm. Impressive Power Consumption Savings I N F I N E O N ’ S M O B I L E - R A M devices achieve these dramatic power consumption savings by measuring the temperature with an integrated sensor.

Part number	HYE18L256160BF-75
Manufacturer	Infineon
File Size	569.46 KB
Description	DRAMs for Mobile Applications
Datasheet	HYE18L256160BF-75 Datasheet

Part Number	Description	Manufacturer
HYE18L512160BF-7.5	DRAMs for Mobile Applications 512-Mbit Mobile-RAM	Qimonda AG
HYE18L512320BF-7.5	DRAMs for Mobile Applications 512-Mbit SDR Mobile-RAM	Qimonda AG
HYE18P64160AF-12.5	Synchronous Burst CellularRAM (1.5G)CellularRAM	Infineon Technologies
HYE18P64160AF-15	Synchronous Burst CellularRAM (1.5G)CellularRAM	Infineon Technologies
HYE18P64160AF-9.6	Synchronous Burst CellularRAM (1.5G)CellularRAM	Infineon Technologies

Part Number	Description
HYE18L256160BF-75	Specialty DRAMs Mobile-RAM
HYE18L256160BC-75	Specialty DRAMs Mobile-RAM
HYE18L256160BC-75	DRAMs for Mobile Applications
HYE18L128160BC-75	Specialty DRAMs Mobile-RAM
HYE18L128160BC-75	DRAMs for Mobile Applications

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Infineon Specialty DRAMs Mobile-RAM w w w. i n f i n e o n . c o m / m e m o r y / Mo b i l e - R A M Never stop thinking.

Published: Apr 23, 2005 |