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HYE18L128160BF-75 - Specialty DRAMs Mobile-RAM

Features

  • M O B I L E - R A M D E V I C E S come in a Fine-pitch Ball Grid Array (FBGA) package. These packages leverage Infineon’s proprietary wire bonding Board-On-Chip (BOC) technology for smallest form factors. The latest product generation further improves form factor by reducing package heights from 1.2 to 1 mm. Impressive Power Consumption Savings I N F I N E O N ’ S M O B I L E - R A M devices achieve these dramatic power consumption savings by measuring the temperature with an integrated sensor.

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Other Datasheets by Infineon

Part Number Description
HYE18L128160BF-75 DRAMs for Mobile Applications
HYE18L128160BC-75 Specialty DRAMs Mobile-RAM
HYE18L128160BC-75 DRAMs for Mobile Applications
HYE18L256160BC-75 Specialty DRAMs Mobile-RAM
HYE18L256160BC-75 DRAMs for Mobile Applications

Full PDF Text Transcription

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Infineon Specialty DRAMs Mobile-RAM w w w. i n f i n e o n . c o m / m e m o r y / Mo b i l e - R A M Never stop thinking.
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