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FS3L50R07W2H3F_B11 - IGBT

Key Features

  • CoolSiC (TM) Schottky diode gen 5.
  • High speed IGBT H3.
  • Low switching losses Mechanical Features.
  • 3 kV AC 1min insulation.
  • Al2O3 substrate with low thermal resistance.
  • Compact design.
  • PressFIT contact technology.
  • Rugged mounting due to integrated mounting clamps Module Label Code Barcode Code 128 DMX - Code Content of the Code Module Serial Number Module Material Number Production Order Number Datecode (Production Year) Da.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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FS3L50R07W2H3F_B11 EasyPACKModulmitschnellemTrench/FeldstoppIGBT3undEmitterControlled3DiodeundPressFIT/ NTC EasyPACKmodulewithfastTrench/FieldstopIGBT3andEmitterControlled3diodeandPressFIT/NTC TypischeAnwendungen • 3-Level-Applikationen • Motorantriebe • SolarAnwendungen • USV-Systeme ElektrischeEigenschaften • CoolSiC(TM)SchottkyDiodeGen5 • HighSpeedIGBTH3 • NiedrigeSchaltverluste MechanischeEigenschaften • 3kVAC1minIsolationsfestigkeit • Al2O3 Substrat mit kleinem thermischen Widerstand • KompaktesDesign • PressFITVerbindungstechnik • Robuste Montage durch integrierte Befestigungsklammern J VCES = 650V IC nom = 50A / ICRM = 100A TypicalApplications • 3-level-applications • Motordrives • Solarapplications • UPSsystems ElectricalFeatures