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FF6MR20W2M1H_B70 - EasyPACK 2B module

General Description

J Datasheet www.infineon.com Please read the sections "Important notice" and "Warnings" at the end of this document Revision 1.10 2024-10-17 FF6MR20W2M1H_B70 EasyPACK™ 2B module Table of contents Table of contents Description

Key Features

  • Electrical features - VDSS = 2000 V - IDN = 160 A / IDRM = 320 A - Overload operation up to 175°C - Suitable Infineon gate drivers can be found under https://www. infineon. com/gdfinder.
  • Mechanical features - AlN substrate with low thermal resistance - High creepage and clearance distances - Integrated NTC temperature sensor - PressFIT contact technology Potential.

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FF6MR20W2M1H_B70 EasyPACK™ 2B module Final datasheet EasyPACK™ 2B module with CoolSiC™ Trench MOSFET and PressFIT / NTC Features • Electrical features - VDSS = 2000 V - IDN = 160 A / IDRM = 320 A - Overload operation up to 175°C - Suitable Infineon gate drivers can be found under https://www.infineon.com/gdfinder • Mechanical features - AlN substrate with low thermal resistance - High creepage and clearance distances - Integrated NTC temperature sensor - PressFIT contact technology Potential applications • EV charging • Energy storage systems (ESS) • Solar applications • DC/DC converter Product validation • Qualified for industrial applications according to the relevant tests of IEC 60747, 60749 and 60068 Description J Datasheet www.infineon.