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Preliminary
SIDC81D60E6
Fast switching diode chip in EMCON-Technology
FEATURES: • 600V EMCON technology 70 µm chip • soft , fast switching • low reverse recovery charge • small temperature coefficient
A
This chip is used for: • EUPEC power modules and discrete devices Applications: • SMPS, resonant applications, drives
C
Chip Type
SIDC81D60E6
VR 600V
IF 200A
Die Size 9 x 9 mm2
Package sawn on foil
Ordering Code Q67050-A4012A001
MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Anode metallisation Cathode metallisation Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 9x9 81 / 69.39 8.28 x 8.
SIDC81D60E6 Datasheet
