IRFP260
Features
- International standard package JEDEC TO-247 AD
- Low RDS (on) HDMOSTM process
- Rugged polysilicon gate cell structure
- High mutating dv/dt rating
- Fast switching times
Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s ww w.D ata Sh eet 4U .co m
Symbol
Test Conditions
Characteristic Values (TJ = 25°C, unless otherwise specified) min. typ. max. 200 2 4 ±100 TJ = 25°C TJ = 125°C 25 250 V V n A µA µA Ω
Applications
- Switch-mode and resonant-mode power supplies
- Motor controls
- Uninterruptible Power Supplies (UPS)
- DC choppers
VDSS
VGS = 0 V, ID = 250 µA VDS = VGS, ID = 250 µA VGS = ±20 VDC, VDS = 0
VGS(th) IGSS
IDSS
VDS = 200V VDS = 160V VGS = 0 V
Advantages
- Easy to mount with 1 screw (isolated mounting screw hole)
- Space savings
- High power density
RDS(on)
VGS = 10 V, ID = 28 A Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
IXYS reserves the right to change limits, test conditions, and dimensions.
97545(1/98)
© 2000 IXYS...
