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ISQ204X3 - LOW INPUT CURRENT PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS

Description

The IS204-3,-2,-1, ISD204-3,-2,-1, ISQ204-3,2,-1 series of optically coupled isolators consist of infrared light emitting diodes and NPN silicon photo transistors in space efficient dual in line plastic packages.

Features

  • l Options :10mm lead spread - add G after part no. Surface mount - add SM after part no. Tape&reel - add SMT&R after part no. l Low input current 0.5mA IF l High Current Transfer Ratio (50% min) l High Isolation Voltage (5.3kVRMS ,7.5kVPK ) l High BVCEO (70V min).

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Datasheet Details

Part number ISQ204X3
Manufacturer ISOCOM COMPONENTS
File Size 103.70 KB
Description LOW INPUT CURRENT PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
Datasheet download datasheet ISQ204X3 Datasheet

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Other Datasheets by ISOCOM COMPONENTS

Part Number Description
ISQ204X1 LOW INPUT CURRENT PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
ISQ204X2 LOW INPUT CURRENT PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
ISQ204 (ISQ201 - ISQ204) HIGH DENSITY PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
ISQ204-1 LOW INPUT CURRENT PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
ISQ204-2 LOW INPUT CURRENT PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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www.DataSheet4U.com IS204X,ISD204X,ISQ204X3,2,1 IS204,ISD204,ISQ204-3,-2,-1 LOW INPUT CURRENT PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS APPROVALS l UL recognised, File No. E91231 'X' SPECIFICATION APPROVALS l VDE 0884 in 3 available lead forms : - STD - G form - SMD approved to CECC 00802 l IS204X is certified to EN60950 by the following Test Bodies :Nemko - Certificate No. P01102464 Fimko - Certificate No. FI18166 Semko - Reference No. 0202037/01-22 Demko - Certificate No. 311158-01 l BSI approved - Cetificate No. 8001 DESCRIPTION The IS204-3,-2,-1, ISD204-3,-2,-1, ISQ204-3,2,-1 series of optically coupled isolators consist of infrared light emitting diodes and NPN silicon photo transistors in space efficient dual in line plastic packages.
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