Datasheet4U Logo Datasheet4U.com

H26M62002JPR - e-NAND

Download the H26M62002JPR datasheet PDF. This datasheet also covers the H26M51002KPR variant, as both devices belong to the same e-nand family and are provided as variant models within a single manufacturer datasheet.

Description

4 1.2 Product Line-up 4 1.3 Key

Features

  • 4 2. Package Configurations 5 2.1 Pin connection 5 2.2 Package Mechanical Drawing 7 3. e-NAND Characteristics 9 3.1 Performance 9 3.2 Power 10 4. e-NAND new features (eMMC5.0 and eMMC5.1) 12 4.1 eMMC5.0 New features 12 4.1.1 HS400 mode 12 4.1.2 Field firmware update 19 4.1.3 Health Report 22 4.1.4 Sleep Notification 23 4.1.5 Secure Removal type 24 4.2 eMMC5.1 New features 25 4.2.1 Command queuing 25 4.2.2 Cache Barrier 29 4.2.3 Cache Flushing report 31 4.2.4 Background operation(B.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (H26M51002KPR-Hynix.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

Part Number Description Manufacturer
H2613 Fast Recovery High Voltage Power Rectifier Micro Quality
H2682 NPN SILICON TRANSISTOR Huashan

Other Datasheets by SK Hynix

Part Number Description
H26M64003DQR 20nm 64Gb e-NAND
H26M11001BAR 1GB e-NAND
H26M51002KPR e-NAND
H26M52003EQR 20nm 64Gb e-NAND
H26M74002HMR e-NAND

Full PDF Text Transcription

Click to expand full text
SK hynix e-NAND Product Family eMMC5.1 Compatible Rev 1.0 / Sep. 2017 1 Revision History Revision No. 0.1 1.0 - Preliminary - Official release History Date May. 29, 2017 Sep. 07, 2017 Remark Rev 1.0 / Sep. 2017 2 Table of Contents 1. Introduction ................................................................................................................. 4 1.1 General Description ............................................................................................................................................................. 4 1.2 Product Line-up ................................................................................................................................................................. 4 1.3 Key Features .........................................
Published: |