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HJ-531IMF - ultra-lowpower Bluetooth

Description

TangShan HongJia Electronic Technology Co., Ltd.

Features

  • 14 4.5 Power Dissipation - 14 5 Reflow Soldering Information- 15 6 Notices for Ultrasound Welding - 16 7 Supply Information - 17 7.1 Model Definition - 17 7.2 Packaging method- 17 - TangShan HongJia Electronic Technology Co. , Ltd. 1 Version History Table 1-1 Revision History No. Version Release Reviser Checker.

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Datasheet Details

Part number HJ-531IMF
Manufacturer HongJia
File Size 928.42 KB
Description ultra-lowpower Bluetooth
Datasheet download datasheet HJ-531IMF Datasheet

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Full PDF Text Transcription

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HJ-531IMF HJ-531IMF Ultra-small Chip (5mmx4.75mm,including ANT,1Mb Flash) ultra-low power Bluetooth 5.1 module Datasheet Data Sheet DataSheet version:V1.2 TangShan HongJia Electronic Technology Co., Ltd. CATALOG HJ-531IMF 1 Version History.......................................................................................................................................................... - 1 2 Overview................................................................................................................................................................... - 2 3 Hardware specification............................................................................................................................................. - 4 - 3.1 Package and dimensions.......................
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