Datasheet4U Logo Datasheet4U.com

HB56D136BW - High Density Dynamic RAM Module

Download the HB56D136BW datasheet PDF. This datasheet also covers the HB56D136 variant, as both devices belong to the same high density dynamic ram module family and are provided as variant models within a single manufacturer datasheet.

Description

The HB56D136 is a 1-M × 36-bit dynamic RAM module, mounted 8 pieces of 4 Mbit DRAM (HM514400CS/CLS) sealed in SOJ package and 2 pieces of 2 Mbit DRAM (HM512200BS/BLS) sealed in SOJ package.

An outline of the HB56D136 is 72-pin single in-line package.

Features

  • 72-pin.
  • Lead pitch: 1.27 mm.
  • Single 5 V (±5%) supply.
  • High speed.
  • Access time: 60 ns/70 ns/80 ns (max).
  • Low power dissipation.
  • Active mode: 5.46 W/4.94 W/4.41 W (max).
  • Standby mode: 105 mW (max) 5.25 mW (max) (L-version).
  • Fast page mode capability.
  • 1,024 refresh cycle: 16 ms 128 ms (L-version).
  • 3 variations of refresh.
  • RAS only refresh.
  • CAS-before-RAS refresh.
  • Hidden ref.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (HB56D136-HitachiSemiconductor.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

Part Number Description Manufacturer
HB56UW1673E-F 128MB Buffered EDO DRAM DIMM 16-Mword X 72-bit Elpida Memory
HB56UW3272ETK-F 256MB Buffered EDO DRAM DIMM 32-Mword X 72-bit Elpida Memory
HB56UW873E-F 64MB Buffered EDO DRAM DIMM 8-Mword X 72-bit Elpida Memory
HB5-433BG LED ETC
HB5-433BG-B LED ETC

Other Datasheets by Hitachi Semiconductor (now Renesas)

Part Number Description
HB56D136 High Density Dynamic RAM Module
HB56D436BR High Density Dynamic RAM Module
HB56D436SBR High Density Dynamic RAM Module
HB56D473EJ-6 High Density Dynamic RAM Module
HB56D473EJ-7 High Density Dynamic RAM Module

Full PDF Text Transcription

Click to expand full text
HB56D136 Series 1,048,576-word × 36-bit High Density Dynamic RAM Module ADE-203-209A (Z) Rev 1.0 Sept. 20, 1994 Description The HB56D136 is a 1-M × 36-bit dynamic RAM module, mounted 8 pieces of 4 Mbit DRAM (HM514400CS/CLS) sealed in SOJ package and 2 pieces of 2 Mbit DRAM (HM512200BS/BLS) sealed in SOJ package. An outline of the HB56D136 is 72-pin single in-line package. Therefore, the HB56D136 makes high density mounting possible without surface mount technology. The HB56D136 provides common data inputs and outputs. Decoupling capacitors are mounted beneath each SOJ. Features • 72-pin — Lead pitch: 1.27 mm • Single 5 V (±5%) supply • High speed — Access time: 60 ns/70 ns/80 ns (max) • Low power dissipation — Active mode: 5.46 W/4.94 W/4.41 W (max) — Standby mode: 105 mW (max) 5.
Published: |