MB05F
Features
- Low profile space - Ideal for automated placement - Glass passivated chip junction - Low forward voltage drop - Low leakage current - High temperature soldering： - 260℃/10 seconds at terminals - ponent in accordance to - Ro HS 2002/95/1 and WEEE 2002/96/EC
- Mechanical Date - Case: MBF Molded plastic - over glass passivated chip - Terminals: Solder plated, solderable per - J-STD-002B and JESD22-B102D - Polarity: Polarity symbols marked on body
Package: MBF
Major Ratings and Characteristics
IF(AV)
0.5A, 0.8A
VRRM
50V ~ 1000V
IFSM
25 A
5 μA
1.0 V
Tj (max.)
150℃
- Maximum Ratings & Thermal Characteristics (TA=25℃, unless otherwise noted)
Items
Symbol MB MB MB MB MB 05F 1F 2F 4F 6F
Peak Repetitive Reverse Voltage DC Blocking Voltage
VRRM
50 100 200 400 600
RMS Reverse Voltage
Maximum DC blocking voltage
Maximum average forward rectified current at TA=30℃ -on glass-epoxy P.C.B (1) -on aluminum substrate (2)
VRMS VDC
IF(AV)
70 140...
