Download S3D Datasheet PDF
General Semiconductor
S3D
FEATURES - Plastic package has Underwriters Laboratory Flammability Classification 94V-0 - For surface mount applications - Low profile package - Built-in strain relief, ideal for automated placement - Glass passivated chip junction - High temperature soldering: 260°C/10 seconds at terminals 0.126 (3.20) 0.114 (2.90) 0.245 (6.22) 0.220 (5.59) 0.280 (7.11) 0.260 (6.60) 0.012 (0.305) 0.006 (0.152) MECHANICAL DATA Case: JEDEC DO-214AB molded plastic body over passivated chip Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Weight: 0.007 ounce, 0.25 gram 0.103 (2.62) 0.079 (2.06) 0.060 (1.52) 0.030 (0.76) 0.320 (8.13) 0.305 (7.75) 0.008 (0.203) MAX. Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS S3A S3B S3G S3J S3K S3M UNITS Device marking code Maximum recurrent peak reverse...