TSM5S10A
Features
- Ideally suited for load dump protection
- Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
- Integrally molded heatsink provides a very low thermal resistance for maximum heat dissipation
- Low leakage current at TJ = 150°C
- High temperature soldering guaranteed: 260°C / 10s at terminals
- Low forward voltage drop
- Qualified to AEC-Q101 Standards
Mechanical Data
- Case: DO-218AB molded plastic
- Terminals: Plated, solderable per MIL-STD-750, Method 2026
Maximum Ratings (@TA = 25°C unless otherwise specified)
Parameter Peak pulse power dissipation with 10/1000μs waveform
10/10,000μs waveform Steady state power dissipation
Peak pulse current with a 10/1000 us waveform(1) Peak forward surge current, 8.3ms single half sine-wave Operating junction and storage temperature range
Symbol
PPPM PD IPPM IFSM TJ, TSTG
Notes- 1: Non-repetitive current pulse derated above TA=25°C
Value 3600 2800 5.0 See Table 1 700 -55 ~ +175
Unit
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