GBU25K
Features
- Planar passivated chips
- Ultra low leakage reverse current
- High temperature performance
- High surge current capability
- Ideal for printed circuit boards
- High temperature soldering guaranteed:260°C/10 seconds
- Ro HS pliant
Mechanical Data
- Case: GBU molded plastic
- Molding pound, UL flammability classification rating 94V-0
- Terminals: Leads solderable per MIL-STD-750,
- Mounting position: Any
Maximum Ratings (@TA = 25°C unless otherwise specified)
Characteristic
Symbol
GBU25J
Peak repetitive reverse voltage
V RRM
RMS reverse voltage
V RMS
DC blocking voltage
VDC 600
Maximum average forward output current
I F(AV)
Peak forward surge current, 8.3ms single half-sine-wave I2t Rating for fusing
@TJ= 25°C @TJ= 25°C
I FSM I2t
300 373
GBU25K 800 560 800
Thermal Characteristics
Parameter
Symbol
GBU25J
Typical thermal...
