FPT-8P-M01 - SMALL OUTLINE L-LEADED PACKAGE

Fujitsu Semiconductor Limited

Datasheet Details

Part number	FPT-8P-M01
Manufacturer	Fujitsu Semiconductor Limited
File Size	49.04 KB
Description	SMALL OUTLINE L-LEADED PACKAGE
Datasheet	FPT-8P-M01 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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FUJITSU SEMICONDUCTOR DATA SHEET SMALL OUTLINE L-LEADED PACKAGE 8 PIN PLASTIC FPT-8P-M01 8-pin plastic SOP Lead pitch Package width × package length Lead shape Sealing method Mounting height Weight 1.27 mm 5.3 × 6.35 mm Gullwing Plastic mold 2.25 mm MAX 0.10 g P-SOP8-5.3×6.35-1.27 (FPT-8P-M01) Code (Reference) www.DataSheet4U.com 8-pin plastic SOP (FPT-8P-M01) *1 6.35 –0.20 .250 –.008 8 +0.25 +.010 Note 1) *1 : These dimensions include resin protrusion. Note 2) *2 : These dimensions do not include resin protrusion. Note 3) Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder. 0.17 –0.04 .007 –.002 +0.03 +.001 5 INDEX *2 5.30±0.30 7.80±0.40 (.209±.012) (.307±.016) Details of "A" part 2.00 –0.15 .079 –.006 1 4 +0.