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HFM307 - Chip Silicon Rectifier

Features

  • Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. For surface mounted.

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Datasheet Details

Part number HFM307
Manufacturer Formosa MS
File Size 70.71 KB
Description Chip Silicon Rectifier
Datasheet download datasheet HFM307 Datasheet

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Other Datasheets by Formosa MS

Part Number Description
HFM307-ASF Chip High Efficiency Rectifiers
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HFM301 Chip Silicon Rectifier
HFM301-ASF Chip High Efficiency Rectifiers
HFM301-Q1 Chip High Efficiency Rectifiers

Full PDF Text Transcription

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Chip Silicon Rectifier HFM301 THRU HFM307 Ultra fast recovery type Formosa MS SMC 0.276(7.0) 0.260(6.6) 0.012(0.3) Typ. Features Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current. 0.032(0.8) Typ. 0.040(1.0) Typ. 0.152(3.8) 0.144(3.6) 0.189(4.8) 0.173(4.4) 0.244(6.2) 0.228(5.8) 0.087(2.2) 0.071(1.8) Mechanical data Case : Molded plastic, JEDEC DO-214AB Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 Polarity : Indicated by c athode band Mounting P osition : Any Weight : 0.00585 ounce, 0.195 gram 0.040 (1.0) Typ.
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