The carrier tape is made from a dissipative (carbon filled) polycarbonate resin.
The cover tape is a m ultilayer film (Heat Activated Adhesive in na ture) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent.
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MMBD301
3
DISCRETE POWER AND SIGNAL TECHNOLOGIES CONNECTION DIAGRAM
3
PACKAGE SOT-23 TO-236AB (Low)
1
4T
1 2 NC SOT-23 TO236AB
2
PACKAGE
Schottky Barrier Diode
Sourced from Process GD
Absolute Maximum Ratings* Sym
Tstg TJ Wiv PF
TA = 25OC unless otherwise noted
Parameter
Storage Temperature Operating Junction Temperature Working Inverse Voltage Forward Power Dissipation @ TA = 25OC Derate above 25OC
Value
-55 to +150 -55 to +125 25 200 2.0
Units
OC OC
V mW Mw/OC
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired
Electrical Characteristics SYM
TA = 25OC unless otherwise noted
CHARACTERISTICS
MIN 30
MAX
UNITS V IR
TEST CONDITIONS = 10 uA 25 V 1.0 mA 10 mA 15 V 1.
MMBD301 Datasheet
