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NCLD3B2512M32 - 16Gb LPDDR3 SDRAM

This page provides the datasheet information for the NCLD3B2512M32, a member of the NCLD3B1256M32 16Gb LPDDR3 SDRAM family.

Datasheet Summary

Description

SYMBOL CS0_n, CS1_n CK_c, CK_t CKE0, CKE1 CA0 ~ CA9 DQ0 ~ DQ31 DM0 ~ DM3 DQS0_t ~ DQS3_t DQS0_c ~ DQS3_c ZQ VDD1 VDD2 VSS VDDQ VDDCA VSSCA VSSQ VREF ODT 8Gb,16Gb: 178-Ball, LPDDR3 SDRAM DESCRIPTION Chip Select Differential Clocks Clock Enable Command / Address Data I/O Input Data Mask Differential

Features

  • [ FBGA ].
  • Operation Temperature - (-25)oC ~ 70 oC.
  • Package - 178-ball FBGA - 12.0x11.5mm2, 1.00t, 0.65mm pitch - Lead & Halogen Free 8Gb,16Gb: 178-Ball, LPDDR3 SDRAM [ LPDDR3 ].
  • VDD1 = 1.8V (1.7V to 1.95V).
  • VDD2, VDDCA and VDDQ = 1.2V (1.14V to 1.30).
  • HSUL_12 interface (High Speed Unterminated Logic 1.2V).
  • Double data rate architecture for command, address and data Bus; - all control and address except CS_n, CKE latched at both rising and falling edge of the clock.

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Datasheet preview – NCLD3B2512M32

Datasheet Details

Part number NCLD3B2512M32
Manufacturer FORESEE
File Size 2.49 MB
Description 16Gb LPDDR3 SDRAM
Datasheet download datasheet NCLD3B2512M32 Datasheet
Additional preview pages of the NCLD3B2512M32 datasheet.

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Full PDF Text Transcription

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178ball FBGA Specification 8Gb LPDDR3 (x32) 16Gb LPDDR3 (x32) V1.0 1 Document Title FBGA 8Gb (x32, 1CS) LPDDR3 16Gb (x32, 2CS) LPDDR3 Revision History Revision No. V1.0 - Initial Draft 8Gb,16Gb: 178-Ball, LPDDR3 SDRAM History Draft Date Dec . 2015 Remark Preliminary 2 FEATURES [ FBGA ] ● Operation Temperature - (-25)oC ~ 70 oC ● Package - 178-ball FBGA - 12.0x11.5mm2, 1.00t, 0.65mm pitch - Lead & Halogen Free 8Gb,16Gb: 178-Ball, LPDDR3 SDRAM [ LPDDR3 ]  VDD1 = 1.8V (1.7V to 1.95V)  VDD2, VDDCA and VDDQ = 1.2V (1.14V to 1.30)  HSUL_12 interface (High Speed Unterminated Logic 1.
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