GP30G
FEATURES
Glass passivated chip junction Hyperectifier structure for high reliability Cavity-free glass-passivated junction Low forward voltage drop Low leakage current, typical IR less than 0.1 µA High forward surge capability Solder dip 260ºC, 10s AEC-Q101 qualified ponent in accordance to Ro HS 2011/65/EU and WEEE 2002/96/EC
MECHANICAL DATA Case: DO-201AD (DO-27). Epoxy meets UL 94V-0 flammability rating. Polarity: Color band denotes cathode end Terminals: Matte tin plated leads, solderable per
MIL-STD-750 Method 2026, J-STD-002 and JESD22-B102. Consumer grade, meets JESD 201 class 1A whisker test. HE3 suffix for high reliability grade, meets JESD 201 class 2 whisker test.
TYPICAL APPLICATIONS
Used in general purpose rectification of power supplies, inverters, converters and freewheeling...
