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FMN4ET4DCF-25IH - 1.8V NAND Flash Memory and Mobile DDR2

Download the FMN4ET4DCF-25IH datasheet PDF. This datasheet also covers the FMN4ST4DCF-25IH variant, as both devices belong to the same 1.8v nand flash memory and mobile ddr2 family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • Operating Temperature Range - Industrial Part : - 40°C ~ 85°C.
  • Package Type : - 162-ball FBGA, 8x10.5mm2, 1.1T, 0.5mm Ball Pitch - Lead & Halogen Free.
  • NAND.
  • Architecture (4G bits) - Input / Output Bus Width: 8-bits / 16-bits - Page size X8 : (4K+256spare) bytes (@1.8V) X16 : (2K+128spare) words (@1.8V) - Block size X8 : (256K+16K) bytes X16 : (128K+8K) words - Plane Size: 2048 Blocks - Device Size: 1 Plane per Device.
  • Page Read / Program - Random Rea.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (FMN4ST4DCF-25IH-Dosilicon.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number FMN4ET4DCF-25IH
Manufacturer Dosilicon
File Size 6.32 MB
Description 1.8V NAND Flash Memory and Mobile DDR2
Datasheet download datasheet FMN4ET4DCF-25IH Datasheet

Other Datasheets by Dosilicon

Part Number Description
FMN4ST4DCF-25IH 1.8V NAND Flash Memory and Mobile DDR2
FMN1ED5SBB-50IA 1.8V NAND Flash Memory and Mobile DDR
FMN1SD5SBB-50IA 1.8V NAND Flash Memory and Mobile DDR
FMN2ET2SCD-25IH 1.8V NAND Flash Memory and Mobile DDR2
FMN2ET2TCD-25IH 1.8V NAND Flash Memory and Mobile DDR2
FMN2ST2SCD-25IH 1.8V NAND Flash Memory and Mobile DDR2
FMN2ST2TCD-25IH 1.8V NAND Flash Memory and Mobile DDR2
FMND2G08S3D-IA 2Gbit NAND Flash Memory
FMND2G08S3D-ID 2Gbit NAND Flash Memory
FMND2G08S3D-IF 2Gbit NAND Flash Memory

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
FMN4xT4DCF-25Ix FMN4xT4DCF-25IH Datasheet • Do not leave this document unattended. • This information contained in this document covered by the non-discloser agreement. • Do not reproduce this document. • This document is property of Dosilicon Co., Ltd. and maybe be required to be returned at any time. Rev. 0.1 Feb. ‘20 Dosilicon Co., Ltd. 1 Document Title Stacked Multi-Chip Product (NAND=4Gb, LPDDR2=2*2Gb) Revision History Revision No. History 0.0 Initial Draft 0.1 Production Release for dimension 1.1mm thickness FMN4xT4DCF-25Ix Draft date Mar., 2019 Feb., 2020 Remark Rev. 0.1 Feb. ‘20 2 FMN4xT4DCF-25Ix Stacked Multi-Chip Product(MCP) 1.8V NAND Flash Memory and Mobile DDR2 1.