GP100
FEATURES
MECHANICAL SPECIFICATION
PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
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ACTUAL SIZE OF DO-41 PACKAGE
SERIES GP100
- GP110 DO
- 41
LL BD (Dia)
EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES LOW FORWARD VOLTAGE DROP 1A at TA = 75 C WITH NO THERMAL RUNAWAY
MECHANICAL DATA
Case: JEDEC DO-41, molded epoxy (U/L Flammability Rating 94V-0) Terminals: Plated axial leads Soldering: Per MIL-STD 202 Method 208 guaranteed Polarity: Color band denotes cathode Mounting Position: Any Weight: 0.012 Ounces (0.34 Grams)
LD (Dia)
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BL Color Band Denotes Cathode
S Ro H
LI MP O C
Sym BL BD LL LD
Minimum In mm 0.160 0.103 1.00 0.028 4.1 2.6 25.4 0.71
Maximum In mm 5.2 0.205 0.107 0.034 2.7 0.86
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
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