CMS-S050-040
Features
:
- Extremely low forward volts
- Guard ring protection
- Low reverse leakage current
Chip size(A):
- 1.270 mm
Bond Pad size(B) :
- 1.143 mm
Thickness : 300µm ± 20µm
Metalization :
Anode Ti/Ni/Ag
Metalization :
Cathode Ti/Ni/Ag
Electrical Characteristics
Sym.
Spec. Limit
Unit
Maximum Instantaneous Forward Volt ° at IF : 2.0Amp. 25 C
..
VF max
Volt
Minimum Instantaneous Reverse Voltage ° at IR : 200 u A 25 C
VR min.
Volt.
Minimum Non-repetitive Peak Surge current at 25 C
°
IFSM
Amp
Storage Temperature
TSTG
-65 to...
